International Forum on Artificial Intelligence and Semiconductor Technology

  • 15 Mar 2018
  • Shanghai, China

What: Sam Wong, Director of China Sales, gave a presentation on the topic "A Smart Interconnect Fabric for Enabling Embedded AI Applications".

From autonomous vehicles to autonomous kitchen appliances, AI solutions must deal with the real world. These chips must combine real-time processing with machine learning accelerators running complex AI algorithms, which requires the implementation of high-performance heterogeneous architectures. This implies an architecture that must deal with real-time cache coherency between different processors running at different speeds and workloads. A smart interconnect fabric is a key enabling technology for next-generation AI systems and reducing the complexity of integrating heterogeneous architectures.

When: March 15, 2018

Where: Shanghai, China 

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